Search

Now showing items 1-10 of 31

Effects of Stress and Electromigration on Microstructural Evolution in Microbumps of Three-Dimensional Integrated Circuits

Type: Journal Paper

Author : Hua Xiong; Zhiheng Huang; Conway, Paul

Publisher: IEEE

Year: 2014

S–Te Interdiffusion within Grains and Grain Boundaries in CdTe Solar Cells

Type: Journal Paper

Author : Li, Cong; Poplawsky, J.; Paudel, Naba; Pennycook, T.J.; Haigh, Sarah J.; Al-Jassim, M.M.; Yan, Y.; Pennycook, S.J.

Publisher: IEEE

Year: 2014

Submicron Cu/Sn Bonding Technology With Transient Ni Diffusion Buffer Layer for 3DIC Application

Type: Journal Paper

Author : Yao-Jen Chang; Yu-Sheng Hsieh; Kuan-Neng Chen

Publisher: IEEE

Year: 2014

Perpendicular Magnetic Anisotropy in MgO/CoFeB/Nb and a Comparison of the Cap Layer Effect

Type: Journal Paper

Author : Der-Sheng Lee; Hao-Ting Chang; Chih-Wei Cheng; Gung Chern

Publisher: IEEE

Year: 2014

Structural, Morphological, and Chemical Properties of Cu/TiN Versus Cu Thin Layers for HEMT Backside Metallization

Type: Journal Paper

Author : Taurino, Antonietta; Signore, Maria Assunta; Catalano, M.; Farella, Isabella; Quaranta, Fabio; Di Giulio, Massimo; Vasanelli, Lorenzo; Siciliano, Pietro

Publisher: IEEE

Year: 2014

Unified modeling of O&M services based on generalized measurement and horizontal correlation

Type: Conference Paper

Author : Chen Bo; Li Peng; Guo Xiaobin; Xu Aidong; Chen Haomin; Xi Wei; Zhou Shuxiong

Publisher: IEEE

Year: 2014

Wafer extreme-far edge related study in BEOL (Back-End-of-Line) including BEOL chemical mechanical polishing at 28nm technology node and beyond

Type: Conference Paper

Author : Lin, Y.M.; Hsu, S.K.; Hsu, L.C.; Hsu, C.H.; Wu, C.L.; Lee, W.K.; Lin, W.C.; Sie, W.S.; Liu, Y.L.; Lee, Y.T.; Wang, O.; Huang, C.C.; Lin, J.F.; Wu, J.Y.

Publisher: IEEE

Year: 2014

Passive fault-tolerant flight controller design against actuator outages

Type: Conference Paper

Author : Yu, Xiang; Zhang, Youmin

Publisher: IEEE

Year: 2014

Leveraging Silicon Epitaxy to Fabricate Excellent Front Surface Regions for Thin Interdigitated Back Contact Solar Cells

Type: Journal Paper

Author : Baker-Finch, Simeon C.; Basore, Paul /A/.

Publisher: IEEE

Year: 2014

A Study of Cu/CuMn Barrier for 22-nm Semiconductor Manufacturing

Type: Journal Paper

Author : Sze-Ann Wu; Yi-Lung Cheng; Chia-Yang Wu; Wen-Hsi Lee

Publisher: IEEE

Year: 2014

Search

Effects of Stress and Electromigration on Microstructural Evolution in Microbumps of Three-Dimensional Integrated Circuits

S–Te Interdiffusion within Grains and Grain Boundaries in CdTe Solar Cells

Submicron Cu/Sn Bonding Technology With Transient Ni Diffusion Buffer Layer for 3DIC Application

Perpendicular Magnetic Anisotropy in MgO/CoFeB/Nb and a Comparison of the Cap Layer Effect

Structural, Morphological, and Chemical Properties of Cu/TiN Versus Cu Thin Layers for HEMT Backside Metallization

Unified modeling of O&M services based on generalized measurement and horizontal correlation

Wafer extreme-far edge related study in BEOL (Back-End-of-Line) including BEOL chemical mechanical polishing at 28nm technology node and beyond

Passive fault-tolerant flight controller design against actuator outages

Leveraging Silicon Epitaxy to Fabricate Excellent Front Surface Regions for Thin Interdigitated Back Contact Solar Cells

A Study of Cu/CuMn Barrier for 22-nm Semiconductor Manufacturing

Author

Publisher

Year

Keywords

Type

Language (ISO)

Content Type

Publication Title

Search

Filters

Effects of Stress and Electromigration on Microstructural Evolution in Microbumps of Three-Dimensional Integrated Circuits

S&#x2013;Te Interdiffusion within Grains and Grain Boundaries in CdTe Solar Cells

Submicron Cu/Sn Bonding Technology With Transient Ni Diffusion Buffer Layer for 3DIC Application

Perpendicular Magnetic Anisotropy in MgO/CoFeB/Nb and a Comparison of the Cap Layer Effect

Structural, Morphological, and Chemical Properties of Cu/TiN Versus Cu Thin Layers for HEMT Backside Metallization

Unified modeling of O&amp;M services based on generalized measurement and horizontal correlation

Wafer extreme-far edge related study in BEOL (Back-End-of-Line) including BEOL chemical mechanical polishing at 28nm technology node and beyond

Passive fault-tolerant flight controller design against actuator outages

Leveraging Silicon Epitaxy to Fabricate Excellent Front Surface Regions for Thin Interdigitated Back Contact Solar Cells

A Study of Cu/CuMn Barrier for 22-nm Semiconductor Manufacturing

S–Te Interdiffusion within Grains and Grain Boundaries in CdTe Solar Cells

Unified modeling of O&M services based on generalized measurement and horizontal correlation