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    A mutual key agreement protocol to mitigate replaying attack in eXpressive Internet Architecture (XIA) 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Backstepping control for longitudinal dynamics of hypersonic flight vehicle 

    Type: Conference Paper
    Author : Peng, Wang; Peng, Li; Ming, Lv
    Publisher: IEEE
    Year: 2014

    An Improved Adaptive Genetic Algorithm for Image Segmentation and Vision Alignment Used in Microelectronic Bonding 

    Type: Journal Paper
    Author : Fujun Wang; Junlan Li; Shiwei Liu; Xingyu Zhao; Dawei Zhang; Yanling Tian
    Publisher: IEEE
    Year: 2014

    Low-Cost Post-Bond Testing of 3-D ICs Containing a Passive Silicon Interposer Base 

    Type: Journal Paper
    Author : Chun-Chuan Chi; Marinissen, Erik Jan; Goel, Sandeep Kumar; Cheng-Wen Wu
    Publisher: IEEE
    Year: 2014

    Development of unmanned inspection equipment for gravity type port structures 

    Type: Conference Paper
    Author : Shin, Changjoo; Han, Sang Hun; Jang, In Sung; Baek, Won Dae; Kim, Kihun
    Publisher: IEEE
    Year: 2014

    3D Integration Using Self-Assembly at Air-Water-Solid Interface 

    Type: Journal Paper
    Author : Kwang Soon Park; Varel, Cagdac; Ji Hao Hoo; Baskaran, R.; Bö hringer, Karl F.
    Publisher: IEEE
    Year: 2014

    A highway vehicle anti-collision protocol based on broadcasting feedback mechanism 

    Type: Conference Paper
    Author : Yang Yang; Nannan Cheng
    Publisher: IEEE
    Year: 2014

    Assessing the effects of field plates in an AlGaN/GaN-on-SiC HEMT model extraction 

    Type: Conference Paper
    Author : Schwitter, B.K.; Tarazi, J.; Parker, A.E.; Mahon, S.J.
    Publisher: IEEE
    Year: 2014

    The experimental study on relationship between shape of diamond and micro scratches 

    Type: Conference Paper
    Author : Dong-won Oh; Hojoong Kim; Myung-sik Han; Ha-sub Hwang; Taesung Kim
    Publisher: IEEE
    Year: 2014

    Heat distribution mathematical model and numerical simulation of an electric oven 

    Type: Conference Paper
    Author : Luo Xuan , Cui Guozhong , Le Fulong
    Publisher: IEEE
    Year: 2014
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