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    Program 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    X-ray tomography for structural analysis of microstructured optical fibres and preforms 

    Type: Conference Paper
    Author : Sandoghchi, S.R.; Jasion, G.T.; Wheeler, N.V.; Wooler, J.P.; Boardman, R.P.; Baddela, N.; Chen, Y.; Hayes, J.; Fokoua, E.Numkam; Bradley, T.; Gray, D.R.; Mousavi, S.M.; Petrovich, M.; Poletti, F.; Richardson, D.J.
    Publisher: IEEE
    Year: 2014

    Process Reliability Data Comparison Guidance and Practise in Advanced Semiconductor Manufacturing Quality Control 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Juice -ESA mission to Jupiter and the Polish contribution 

    Type: Conference Paper
    Author : Rothkaehl, H. , Morawski, M. , Grygorczuk, J.
    Publisher: IEEE
    Year: 2014

    Non-contact thermoacoustic imaging based on laser and microwave vibrometry 

    Type: Conference Paper
    Author : Yexian Qin; Ingram, P.; Xiong Wang; Tao Qin; Hao Xin; Witte, R.S.
    Publisher: IEEE
    Year: 2014

    Dynamics of intra super-channel fiber nonlinearity compensation in flex-grid optical networks 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Influence of solder volume and interfacial reaction on the undercooling and solidification microstructure of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints 

    Type: Conference Paper
    Author : Lang Zhang; Min-Bo Zhou; Xin-Ping Zhang
    Publisher: IEEE
    Year: 2014

    Self-reconfiguration strategy for energy extraction improvement of island renewable energy sources 

    Type: Conference Paper
    Author : Liu, Hongda; Zhou, Lei
    Publisher: IEEE
    Year: 2014

    A numerical study of aerosol effects on electrification of thunderstorms 

    Type: Conference Paper
    Author : Shi, Zheng; Tan, Yong Bo
    Publisher: IEEE
    Year: 2014

    MAGE: Matching approximate patterns in richly-attributed graphs 

    Type: Conference Paper
    Author : Pienta, Robert; Tamersoy, Acar; Tong, Hanghang; Chau, Duen Horng
    Publisher: IEEE
    Year: 2014
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