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Optimized Micro-Channel Design for Stacked 3-D-ICs
Publisher: IEEE
Year: 2014
Table of contents
Publisher: IEEE
Year: 2014
Collaborative medical diagnosis through Fuzzy Petri Net based agent argumentation
Publisher: IEEE
Year: 2014
Thermal Characterization of Both Bare Die and Overmolded 2.5-D Packages on Through Silicon Interposers
Publisher: IEEE
Year: 2014
The importance of inspections on electrical installations in hazardous locations
Publisher: IEEE
Year: 2014
[Back cover]
Publisher: IEEE
Year: 2014