Search

Now showing items 1-10 of 47

A High Voltage DC-DC Converter for Applications In Harsh Environments

Type: Conference Paper

Author : Siadatan, Alireza; Hosseini, S. Mahdi

Request PDF

Capacitive Pressure Sensors Based on MEMS, Operating in Harsh Environments

Type: Conference Paper

Author : Y. Hezarjaribi; M. N. Hamidon; سیدحسین کشمیری; A. R. Bahadorimehr; Sayyed-Hossein Keshmiri

Year: 2008

Abstract:

Poly-crystalline silicon carbide (poly SiC) Micro-electromechanical systems (MEMS) capacitive pressure sensors operating at harsh environments (e.g. high temperature) are proposed because of SiC owing excellent electrical stability, mechanical...

Special Series on Harsh Chips [Guest editors' introduction]

Type: Journal Paper

Author : Vega, Augusto; Buyuktosunoglu, Alper; Bose, Pradip

Publisher: IEEE

Year: 2014

Design and Development of CMOS Image Sensor for Motion Detection &amp; Localization

Type: Conference Paper

Author : Moon, S. , Deotale, T.

Publisher: IEEE

Year: 2014

Climate-Protective Packaging: Using Basic Physics to Solve Climatic Challenges for Electronics in Demanding Applications

Type: Journal Paper

Author : Jacobsen, John Bjerregaard; Krog, Jens Peter; Rimestad, Lars; Riis, Annemette; Holm, Allan Hjarbaek

Publisher: IEEE

Year: 2014

Development of a Temperature Distributed Monitoring System Based On Raman Scattering in Harsh Environment

Type: Journal Paper

Author : Cangialosi, C.; Ouerdane, Y.; Girard, S.; Boukenter, A.; Delepine-Lesoille, S.; Bertrand, J.; Marcandella, C.; Paillet, P.; Cannas, M.

Publisher: IEEE

Year: 2014

Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

Type: Journal Paper

Author : Navarro, Luis /A/.; Perpina, Xavier; Godignon, P.; Montserrat, J.; Banu, V.; Vellvehi, Miquel; Jorda, Xavier

Publisher: IEEE

Year: 2014

Experimental Characterization of Diversity Navigation

Type: Journal Paper

Author : Conti, Andrea; Dardari, Davide; Guerra, M.; Mucchi, L.; Win, Moe Z.

Publisher: IEEE

Year: 2014

Chiral Fibers: Microformed Optical Waveguides for Polarization Control, Sensing, Coupling, Amplification, and Switching

Type: Journal Paper

Author : Kopp, V.I.; Jongchul Park; Wlodawski, Mitchell; Singer, J.; Neugroschl, D.; Genack, A.Z.

Publisher: IEEE

Year: 2014

Genetic algorithm based geometry optimization of inductively coupled printed spiral coils for remote powering of electronic implantable devices

Type: Conference Paper

Author : Mehri, Sondos; Ben Hadj Slama, Jaleleddine; Ammari, Ahmed C.; Rmili, Hatem

Publisher: IEEE

Year: 2014

1
2
3
4
. . .
5

Search

A High Voltage DC-DC Converter for Applications In Harsh Environments

Capacitive Pressure Sensors Based on MEMS, Operating in Harsh Environments

Special Series on Harsh Chips [Guest editors' introduction]

Design and Development of CMOS Image Sensor for Motion Detection &amp; Localization

Climate-Protective Packaging: Using Basic Physics to Solve Climatic Challenges for Electronics in Demanding Applications

Development of a Temperature Distributed Monitoring System Based On Raman Scattering in Harsh Environment

Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

Experimental Characterization of Diversity Navigation

Chiral Fibers: Microformed Optical Waveguides for Polarization Control, Sensing, Coupling, Amplification, and Switching

Genetic algorithm based geometry optimization of inductively coupled printed spiral coils for remote powering of electronic implantable devices

Author

Publisher

Year

Keywords

Type

Language (ISO)

Content Type

Publication Title

Search

Filters

A High Voltage DC-DC Converter for Applications In Harsh Environments

Capacitive Pressure Sensors Based on MEMS, Operating in Harsh Environments

Special Series on Harsh Chips [Guest editors' introduction]

Design and Development of CMOS Image Sensor for Motion Detection &amp;amp; Localization

Climate-Protective Packaging: Using Basic Physics to Solve Climatic Challenges for Electronics in Demanding Applications

Development of a Temperature Distributed Monitoring System Based On Raman Scattering in Harsh Environment

Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

Experimental Characterization of Diversity Navigation

Chiral Fibers: Microformed Optical Waveguides for Polarization Control, Sensing, Coupling, Amplification, and Switching

Genetic algorithm based geometry optimization of inductively coupled printed spiral coils for remote powering of electronic implantable devices

Design and Development of CMOS Image Sensor for Motion Detection & Localization