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    Indoor localization system benchmark based on wireless local network technologies 

    Type: Conference Paper
    Author : Lyazdi, S. , El Khadimi, A. , Zaz, Y.
    Publisher: IEEE
    Year: 2014

    Spectral and Injection Level Dependence of Recombination Lifetimes in Silicon Measured by Impedance Spectroscopy 

    Type: Journal Paper
    Author : Kumar, Sudhakar; Vandana; Rauthan, C.M.S.; Kaul, V.K.; Singh, S.N.; Singh, Praveen Kumar
    Publisher: IEEE
    Year: 2014

    Evaluation of Carrier Collection Efficiency in Multiple Quantum Well Solar Cells 

    Type: Journal Paper
    Author : Fujii, Hiromitsu; Toprasertpong, Kasidit; Watanabe, K.; Sugiyama, Masakazu; Nakano, Yoshiaki
    Publisher: IEEE
    Year: 2014

    Dual Functionality of a Simple Magnetic/Semiconductor Heterostructure Device: Diode and Magnetoresistive Element 

    Type: Journal Paper
    Author : Sarkar, Anirban; Adhikari, Rajdeep; Das, Amal K.
    Publisher: IEEE
    Year: 2014

    Electromigration-induced degradation around electrode of GaN light-emitting diode in water vapour 

    Type: Journal Paper
    Author : Chen, Huanting; Chang, Hung-Wei; Shei, Shih-Chang; Hung, Shih-Hao; Sheu, Meng-Lieh
    Publisher: IET
    Year: 2014

    Tutorial T6A: Pedagogy of Negative Feedback Circuits 

    Type: Conference Paper
    Author : Krishnapura, N.
    Year: 2014

    Simple interpolants for linear arithmetic 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Failure Analysis Techniques for Microsystems-Enabled Photovoltaics 

    Type: Journal Paper
    Author : Yang, Benjamin B.; Cruz-Campa, Jose Luis; Haase, Gaddi S.; Cole, Edward /I/.; Tangyunyong, Paiboon; Resnick, P.J.; Kilgo, Alice C.; Okandan, Murat; Nielson, Gregory N.
    Publisher: IEEE
    Year: 2014

    Automating the Integration of Clinical Studies into Medical Ontologies 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Proximity effects between striplines and vias 

    Type: Conference Paper
    Author : Kwark, Y.H.; Rimolo-Donadio, R.; Baks, C.W.; Muller, S.; Schuster, C.
    Publisher: IEEE
    Year: 2014
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