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RISDevelopment of new concept thermoplastic temporary adhesive for 3D-IC integration
Publisher: IEEE
Year: 2014
Open innovation strategies in top R&D spending companies
Publisher: IEEE
Year: 2014
From Input Private to Universally Composable Secure Multi-party Computation Primitives
Publisher: IEEE
Year: 2014
A Virtualization Layer Approach to Survivability
Publisher: IEEE
Year: 2014
Planar single-layer leaky-wave antenna array
Publisher: IEEE
Year: 2014
A framework for face classification under pose variations
Publisher: IEEE
Year: 2014
A Model Approach to the Estimation of Peer-to-Peer Traffic Matrices
Publisher: IEEE
Year: 2014
Bounds of Asymptotic Performance Limits of Social-Proximity Vehicular Networks
Publisher: IEEE
Year: 2014
Teaching RFID Information Systems Security
Publisher: IEEE
Year: 2014
The Silence of the LANs: Efficient Leakage Resilience for IPsec VPNs
Publisher: IEEE
Year: 2014