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Real-Time Temperature Estimation for Power MOSFETs Considering Thermal Aging Effects

Type: Journal Paper

Author : Huifeng Chen; Bing Ji; Pickert, Volker; Wenping Cao

Publisher: IEEE

Year: 2014

Measuring Prediction Sensitivity of a Cloud Auto-scaling System

Type: Conference Paper

Author : Nikravesh, A.Y. , Ajila, S.A. , Chung-Horng Lung

Publisher: IEEE

Year: 2014

Indoor positioning of wheeled devices for Ambient Assisted Living: A case study

Type: Conference Paper

Publisher: IEEE

Year: 2014

Author

Bing Ji (1)

Huifeng Chen (1)

Nikravesh, A.Y. , Ajila, S.A. , Chung-Horng Lung (1)

Pickert, Volker (1)

Wenping Cao (1)

Publisher

IEEE (3)

Year

2014 (3)

Keywords

thermal expansion (3)

coefficient-of-thermal expansion (2)

electronics packaging (2)

#x03B3 (1)

&amp (1)

(y-aminopropyl) triethoxysilane (1)

-(2,3-epoxypropoxy) propytrimethoxysilane (1)

active control (1)

alumina ceramic substrate (1)

alumina-copper joints (1)

Type

Conference Paper (2)

Journal Paper (1)

Language (ISO)

English (3)

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Metadata Only (3)

Publication Title

Device and Materials Reliability, IEEE Transactions on (1)

nstrumentation and Measurement Technology Conference (I2MTC) Proceedings, 2014 IEEE International (1)

omputer Software and Applications Conference Workshops (COMPSACW), 2014 IEEE 38th International (1)

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