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Leveraging Silicon Epitaxy to Fabricate Excellent Front Surface Regions for Thin Interdigitated Back Contact Solar Cells

Type: Journal Paper

Author : Baker-Finch, Simeon C.; Basore, Paul /A/.

Publisher: IEEE

Year: 2014

A Study of Cu/CuMn Barrier for 22-nm Semiconductor Manufacturing

Type: Journal Paper

Author : Sze-Ann Wu; Yi-Lung Cheng; Chia-Yang Wu; Wen-Hsi Lee

Publisher: IEEE

Year: 2014

Hydrothermal Formation of Tungsten Trioxide Nanowire Networks on Seed-Free Substrates and Their Properties in Electrochromic Device

Type: Journal Paper

Author : Chung Jung Hung; Yi Hsuan Huang; Chih Hao Chen; Pang Lin; Tseung Yuen Tseng

Publisher: IEEE

Year: 2014

Compressive coded video compression using measurement domain motion estimation

Type: Conference Paper

Author : Narayanan, S. , Makur, A.

Year: 2014

A Simple Model Describing the Symmetric <formula formulatype="inline"> <img src="/images/tex/21072.gif" alt="I\\hbox {--}V"> </formula> Characteristics of <formula formulatype="inline"> <img src="/images/tex/21456.gif" alt="\\hbox {p}"> </formula> Polycrystalline Si/ <formula formulatype="inline"> <img src="/images/tex/18665.gif" alt="\\hbox {n}"> </formula

Type: Journal Paper

Author : Peibst, Robby; Rö mer, Udo; Hofmann, Karl Rudiger; Lim, B.; Wietler, Tobias F.; Krü gener, Jan; Harder, Nils-Peter; Brendel, Rolf

Publisher: IEEE

Year: 2014

Plasma cleaning and its application in microwave module wire bonding technology

Type: Conference Paper

Author : Han Zongjie; Yan Wei; Hu Yongfang; Li Xiaoxuan

Publisher: IEEE

Year: 2014

Time Evolution Degradation Physics in High Power White LEDs Under High Temperature-Humidity Conditions

Type: Journal Paper

Author : Cher Ming Tan; Singh, Prashant

Publisher: IEEE

Year: 2014

S–Te Interdiffusion within Grains and Grain Boundaries in CdTe Solar Cells

Type: Journal Paper

Author : Li, Cong; Poplawsky, J.; Paudel, Naba; Pennycook, T.J.; Haigh, Sarah J.; Al-Jassim, M.M.; Yan, Y.; Pennycook, S.J.

Publisher: IEEE

Year: 2014

Submicron Cu/Sn Bonding Technology With Transient Ni Diffusion Buffer Layer for 3DIC Application

Type: Journal Paper

Author : Yao-Jen Chang; Yu-Sheng Hsieh; Kuan-Neng Chen

Publisher: IEEE

Year: 2014

Proton Radiation-Induced Void Formation in Ni/Au-Gated AlGaN/GaN HEMTs

Type: Journal Paper

Author : Koehler, Andrew D.; Specht, Petra; Anderson, Travis J.; Weaver, Bradley D.; Greenlee, Jordan D.; Tadjer, Marko J.; Porter, Matthew; Wade, Mark; Dubon, Oscar C.; Hobart, Karl D.; Weatherford, Todd R.; Kub, Francis J.

Publisher: IEEE

Year: 2014

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Leveraging Silicon Epitaxy to Fabricate Excellent Front Surface Regions for Thin Interdigitated Back Contact Solar Cells

A Study of Cu/CuMn Barrier for 22-nm Semiconductor Manufacturing

Hydrothermal Formation of Tungsten Trioxide Nanowire Networks on Seed-Free Substrates and Their Properties in Electrochromic Device

Compressive coded video compression using measurement domain motion estimation

Plasma cleaning and its application in microwave module wire bonding technology

Time Evolution Degradation Physics in High Power White LEDs Under High Temperature-Humidity Conditions

S–Te Interdiffusion within Grains and Grain Boundaries in CdTe Solar Cells

Submicron Cu/Sn Bonding Technology With Transient Ni Diffusion Buffer Layer for 3DIC Application

Proton Radiation-Induced Void Formation in Ni/Au-Gated AlGaN/GaN HEMTs

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Leveraging Silicon Epitaxy to Fabricate Excellent Front Surface Regions for Thin Interdigitated Back Contact Solar Cells

A Study of Cu/CuMn Barrier for 22-nm Semiconductor Manufacturing

Hydrothermal Formation of Tungsten Trioxide Nanowire Networks on Seed-Free Substrates and Their Properties in Electrochromic Device

Compressive coded video compression using measurement domain motion estimation

Plasma cleaning and its application in microwave module wire bonding technology

Time Evolution Degradation Physics in High Power White LEDs Under High Temperature-Humidity Conditions

S&#x2013;Te Interdiffusion within Grains and Grain Boundaries in CdTe Solar Cells

Submicron Cu/Sn Bonding Technology With Transient Ni Diffusion Buffer Layer for 3DIC Application

Proton Radiation-Induced Void Formation in Ni/Au-Gated AlGaN/GaN HEMTs

S–Te Interdiffusion within Grains and Grain Boundaries in CdTe Solar Cells