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Now showing items 1-10 of 12

Equivalent circuit of multi-gap output cavity for sheet beam EIK

Type: Conference Paper

Author : Shuyuan Chen , Cunjun Ruan , Yong Wang

Publisher: IEEE

Year: 2014

Field Exposure and Dosimetry in the THz Frequency Range

Type: Journal Paper

Author : Kleine-Ostmann, Thomas; Jastrow, Christian; Baaske, Kai; Heinen, Bernd; Schwerdtfeger, Michael; Karst, Uwe; Hintzsche, Henning; Stopper, Helga; Koch, Martin; Schrader, Thorsten

Publisher: IEEE

Year: 2014

Is Conductive Adhesive Bonding Suited for the Die-Attachment of Power Devices?

Type: Conference Paper

Publisher: IEEE

Year: 2014

An Assessment of Available Models for the Design of Schottky-Based Multipliers Up to THz Frequencies

Type: Journal Paper

Author : Pardo, Diego; Grajal, Jesus; Perez-Moreno, Carlos G.; Perez, Sandra

Publisher: IEEE

Year: 2014

Automated diagnosis of material condition in hammering test using a boosting algorithm

Type: Conference Paper

Author : Fujii, Hiromitsu; Yamashita, Atsushi; Asama, Hajime

Publisher: IEEE

Year: 2014

Performance of cognitive radio networks with finite buffer using multiple vacations and exhaustive service

Type: Conference Paper

Author : Phan, Hoc; Chu, Thi My Chinh; Zepernick, Hans-Jurgen; Ngo, Hien Quoc

Publisher: IEEE

Year: 2014

Analysis of substrate shielding methods for sub-THz on-chip inductors

Type: Journal Paper

Author : Chun-Ho Jeong; Jong-Phil Hong

Publisher: IET

Year: 2014

Optimizing Energy Consumption in Terahertz Band Nanonetworks

Type: Journal Paper

Author : Mohrehkesh, Shahram; Weigle, Michele C.

Publisher: IEEE

Year: 2014

Hydrogen generation/pressure enhancement using FC and ANN based MPPT assisted PV system

Type: Conference Paper

Author : Pachauri, R.K.; Chauhan, Y.K.

Publisher: IEEE

Year: 2014

A 4.28 pJ/access high-density average-8T sub-threshold SRAM with reverse narrow-width effect (RNWE)-aware sizing

Type: Conference Paper

Author : Khayatzadeh, M.; Yong Lian

Publisher: IEEE

Year: 2014

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Equivalent circuit of multi-gap output cavity for sheet beam EIK

Field Exposure and Dosimetry in the THz Frequency Range

Is Conductive Adhesive Bonding Suited for the Die-Attachment of Power Devices?

An Assessment of Available Models for the Design of Schottky-Based Multipliers Up to THz Frequencies

Automated diagnosis of material condition in hammering test using a boosting algorithm

Performance of cognitive radio networks with finite buffer using multiple vacations and exhaustive service

Analysis of substrate shielding methods for sub-THz on-chip inductors

Optimizing Energy Consumption in Terahertz Band Nanonetworks

Hydrogen generation/pressure enhancement using FC and ANN based MPPT assisted PV system

A 4.28 pJ/access high-density average-8T sub-threshold SRAM with reverse narrow-width effect (RNWE)-aware sizing

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Equivalent circuit of multi-gap output cavity for sheet beam EIK

Field Exposure and Dosimetry in the THz Frequency Range

Is Conductive Adhesive Bonding Suited for the Die-Attachment of Power Devices?

An Assessment of Available Models for the Design of Schottky-Based Multipliers Up to THz Frequencies

Automated diagnosis of material condition in hammering test using a boosting algorithm

Performance of cognitive radio networks with finite buffer using multiple vacations and exhaustive service

Analysis of substrate shielding methods for sub-THz on-chip inductors

Optimizing Energy Consumption in Terahertz Band Nanonetworks

Hydrogen generation/pressure enhancement using FC and ANN based MPPT assisted PV system

A 4.28 pJ/access high-density average-8T sub-threshold SRAM with reverse narrow-width effect (RNWE)-aware sizing