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Electromigration for advanced Cu interconnect and the challenges with reduced pitch bumps

Type: Conference Paper

Author : Islam, N. , Gwang Kim , KyungOe Kim

Publisher: IEEE

Year: 2014

Improving the target impedance method for PCB decoupling of core power

Type: Conference Paper

Author : Guang Chen , Dan Oh

Publisher: IEEE

Year: 2014

Replacing the PECVD-SiO<inf>2</inf> in the through-silicon via of high-density 3D LSIs with highly scalable low cost organic liner: Merits and demerits

Type: Conference Paper

Publisher: IEEE

Year: 2014

Author

Guang Chen , Dan Oh (1)

Islam, N. , Gwang Kim , KyungOe Kim (1)

Publisher

IEEE (3)

Year

2014 (3)

Keywords

Cameras (3)

Computational modeling (3)

SCGMM (3)

3D reconstruction (2)

Color (2)

Multi-view foreground segmentation (2)

Probabilistic logic (2)

Solid modeling (2)

Three-dimensional displays (2)

3D probabilistic model (1)

Type

Conference Paper (3)

Language (ISO)

English (3)

Content Type

Metadata Only (3)

Publication Title

lectronic Components and Technology Conference (ECTC), 2014 IEEE 64th (3)

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