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    Smart Reliable Network-on-Chip 

    Type: Journal Paper
    Author : Killian, Cedric; Tanougast, Camel; Monteiro, Fabrice; Dandache, A.
    Publisher: IEEE
    Year: 2014

    A Reliability Enhanced Address Mapping Strategy for Three-Dimensional (3-D) NAND Flash Memory 

    Type: Journal Paper
    Author : Yi Wang; Zili Shao; Chan, Henry; Bathen, L.A.D.; Dutt, N.D.
    Publisher: IEEE
    Year: 2014

    Web technology based microelectrode characterization instrument 

    Type: Conference Paper
    Author : Zhe Hu; Troyk, P.; DeMichele, G.; Kerns, D.; Bak, M.
    Publisher: IEEE
    Year: 2014

    Using SDN in centralized data centers in power communication networks for disaster recovery 

    Type: Conference Paper
    Author : Yang Wang; Yiming Yu; Yongli Zhao; Jie Zhang
    Publisher: IEEE
    Year: 2014

    An Improved Cuckoo Search Algorithm with Adaptive Method 

    Type: Conference Paper
    Author : Zhenxing Zhang; Yongjie Chen
    Publisher: IEEE
    Year: 2014

    Secure Transmission Design and Performance Analysis for Cooperation Exploring Outdated CSI 

    Type: Journal Paper
    Author : Yueming Cai; Xinrong Guan; Weiwei Yang
    Publisher: IEEE
    Year: 2014

    Large scale data storage and processing of insulator leakage current using HBase and mapreduce 

    Type: Conference Paper
    Author : Song, Yaqi; Zhu, Yongli; Li, Li
    Publisher: IEEE
    Year: 2014

    The study of electromagnetic transient simulation in whole scene intelligent substation test method 

    Type: Conference Paper
    Author : Wang Biao
    Publisher: IEEE
    Year: 2014

    Bird species recognition from field recordings using HMM-based modelling of frequency tracks 

    Type: Conference Paper
    Author : Jancovic, P. , Kokuer, M. , Russell, M.
    Publisher: IEEE
    Year: 2014

    Study on a novel CMP/P-CVM fusion processing system (Type B) and its basic characteristics 

    Type: Conference Paper
    Author : Oyama, K.; Doi, T.K.; Sano, Y.; Kurokawa, S.; Aida, H.; Miyashita, T.; Seongwoo Kim; Yamazaki, T.; Nishizawa, H.
    Publisher: IEEE
    Year: 2014
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