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    BOOSTER: Development of a Toolbox for<newline/> Triage of Large Groups of Individuals <newline/>Exposed to Radioactive Material 

    Type: Journal Paper
    Author : Schoepff, Vincent; Alma&#x0301; si, Istva&#x0301; n; Amgarou, Khalil; Becker, Frank; Carrel, F.; Carvajal, Federico; Gaboriau, David C.; Gmar, M.; Kelemen, Andra&#x0301; s; Kova&#x0301; cs, Andra&#x0301; s; Kova&#x0301; cs-Sze&#x0301; les, E&#x0301; va; Lemaire, Hermine; Menaa, Nabil; Mesterha&#x0301; zy, Da&#x0301; vid; Morat, Luc; Morrison, Ciaran G.; Perez-llopis, Israel; Raskob, Wolfgang; Robbe, Marie-France; Szabo, Stanislav; Testard, Isabelle; Trybushnyi, Dmytro; Ugolin, Nicola
    Publisher: IEEE
    Year: 2014

    Photonic curing of ligand-capped CuInSe<inf>2</inf> nanocrystal films 

    Type: Conference Paper
    Author : Stolle, C.J.; Harvey, T.B.; Korgel, B.A.
    Publisher: IEEE
    Year: 2014

    Active control method on flutter suppression of a high-aspect-ratio two-dimensional airfoil with a control surface 

    Type: Conference Paper
    Author : Yang, P.; Li, Q.D.; Ren, Z.; Tan, Q.K.; Fan, Y.
    Publisher: IEEE
    Year: 2014

    Scaling laws for molecular communication 

    Type: Conference Paper
    Author : Eckford, A.W. , Chan-Byoung Chae
    Publisher: IEEE
    Year: 2014

    Characterization of Old Nuclear Waste Packages Coupling Photon Activation Analysis and Complementary Non-Destructive Techniques 

    Type: Journal Paper
    Author : Carrel, F.; Charbonnier, B.; Coulon, Romain; Laine&#x0301; , Fre&#x0301; de&#x0301; ric; Normand, S.; Salmon, C.; Sari, Ali
    Publisher: IEEE
    Year: 2014

    Non-invasive monitoring of the relation between building materials and indoor radon pollution 

    Type: Journal Paper
    Author : Lamonaca, F.; Vasile, M.; Nastro, A.
    Publisher: IET
    Year: 2014

    AC breakdown voltage of thermal bubble induced two-phase flow condition of inflammable fluorocarbon by self-heating electrode 

    Type: Conference Paper
    Author : Wenhao Niu; Guoqiang Zhang; Haifeng Zhong; Tao Lin
    Publisher: IEEE
    Year: 2014

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