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    A compact wideband high power amplifier in GaN technology with 47% peak PAE 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Contents 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Electromigration reliability of cylindrical Cu pillar SnAg<inf>3.0</inf>Cu<inf>0.5</inf> bumps 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Size effect on the microbridges quality factor tested in free air space 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Preface 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    A convenient linearity calibration method for precision ratio bridges 

    Type: Conference Paper
    Author : Le Chen; Dongbo Ma; Jianping Sun
    Publisher: IEEE
    Year: 2014

    Habit change as a learning process: Design framework for mobile interventions 

    Type: Conference Paper
    Author : Vainio, J. , Kaipainen, K. , Korhonen, I.
    Publisher: IEEE
    Year: 2014

    A wireless power transfer system for electrical vehicles exploiting magnetically coupled resonance and a tapped capacitance impedance transformer 

    Type: Conference Paper
    Author : Rotaru, M.D.; Tan Yen Kheng; Sykulski, J.K.
    Publisher: IEEE
    Year: 2014

    Optimal sizing of PV array for critical load with parallel redundant architecture using GA 

    Type: Conference Paper
    Author : Raviprasad, V. , Singh, R.K.
    Publisher: IEEE
    Year: 2014

    Centralized Flat Routing 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014
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