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    Grounding Versus Bonding: What the National Electrical Code Does Not Explain 

    Type: Journal Paper
    Author : Rappaport, Elliot
    Publisher: IEEE
    Year: 2014

    Barrier smoothing for nonsmooth convex minimization 

    Type: Conference Paper
    Author : Quoc Tran-Dinh , Yen-Huan Li , Cevher, V.
    Publisher: IEEE
    Year: 2014

    AFCIs—From a Standards Perspective 

    Type: Journal Paper
    Author : Lippert, Kevin J.; Domitrovich, Thomas /A/.
    Publisher: IEEE
    Year: 2014

    Image stitching algorithm research based on OpenCV 

    Type: Conference Paper
    Author : Chen Kaili , Wang Meiling
    Publisher: IEEE
    Year: 2014

    Adhesion and reliability of direct Cu metallization of through-package vias in glass interposers 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Short-Circuit Current Ratings: Key Considerations for the Safety of Commercial and Industrial Electrical Systems 

    Type: Journal Paper
    Author : Neeser, Daniel R.
    Publisher: IEEE
    Year: 2014

    Optimization of the issues in the migration from Android Native to Hybrid Application: Case study of Student's Portal application 

    Type: Conference Paper
    Author : Ahuja, Heena; Johari, Rahul
    Publisher: IEEE
    Year: 2014

    Characteristics, Selection Guidelines, and Performance of Circuit Protection Devices for ASDs 

    Type: Journal Paper
    Author : Neeser, Daniel R.; Schlegel, David W.; Verstegen, Louis; Lemberg, Nicholas
    Publisher: IEEE
    Year: 2014

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