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Simulations of damage and fracture in ULK under pad structures during Cu wirebond process
Publisher: IEEE
Year: 2014
Title page
Publisher: IEEE
Year: 2014
Interface Charge Engineering for Enhancement-Mode GaN MISHEMTs
Publisher: IEEE
Year: 2014
Modeling of a MOS Ultralow Voltage Astable Multivibrator for Energy Harvesting
Publisher: IEEE
Year: 2014
Performance improvement techniques for RSSI based localization methods
Publisher: IEEE
Year: 2014
Correction of in phase-quadrature imbalance in the presence of multipath fading
Publisher: IEEE
Year: 2014
Metal–Insulator–Semiconductor Photodetectors With Different Coverage Ratios of Graphene Oxide
Publisher: IEEE
Year: 2014