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    Simulations of damage and fracture in ULK under pad structures during Cu wirebond process 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    <italic>C</italic>-band complementary metal-oxide-semiconductor bandpass filter using active capacitance circuit 

    Type: Journal Paper
    Author : Sen Wang; Wen-Jie Lin
    Publisher: IET
    Year: 2014

    Batteryless Transceiver Prototype for Medical Implant in 0.18-<formula formulatype="inline"> <img src="/images/tex/241.gif" alt="\\mu"> </formula>m CMOS Technology 

    Type: Journal Paper
    Author : Hsiao-Chin Chen; Ming-Yu Yen; Qi-Xiu Wu; Kuo-Jin Chang; Li-Ming Wang
    Publisher: IEEE
    Year: 2014

    Title page 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Interface Charge Engineering for Enhancement-Mode GaN MISHEMTs 

    Type: Journal Paper
    Author : Ting-Hsiang Hung; Pil Sung Park; Krishnamoorthy, Sriram; Nath, Digbijoy; Rajan, Sreeraman
    Publisher: IEEE
    Year: 2014

    Modeling of a MOS Ultralow Voltage Astable Multivibrator for Energy Harvesting 

    Type: Journal Paper
    Author : Telles, Antonio C. C.; Finco, Saulo; Pomilio, J.A.
    Publisher: IEEE
    Year: 2014

    Surface Passivation of Ge MOS Devices by <formula formulatype="inline"> <img src="/images/tex/21412.gif" alt="{\\rm SmGeO}_{\\bf{x}}"> </formula> With Sub-nm EOT 

    Type: Journal Paper
    Author : Chia-Chun Lin; Yung-Hsien Wu; Chao-Yi Wu; Ching-Wei Lee
    Publisher: IEEE
    Year: 2014

    Performance improvement techniques for RSSI based localization methods 

    Type: Conference Paper
    Author : Al Shayokh, M. , Alkasi, U. , Partal, H.P.
    Publisher: IEEE
    Year: 2014

    Correction of in phase-quadrature imbalance in the presence of multipath fading 

    Type: Conference Paper
    Author : Haq, K.N. , Kah Seng Chung
    Publisher: IEEE
    Year: 2014

    Metal&#x2013;Insulator&#x2013;Semiconductor Photodetectors With Different Coverage Ratios of Graphene Oxide 

    Type: Journal Paper
    Author : Chu-Hsuan Lin; Wei-Ting Yeh; Mei-Hsin Chen
    Publisher: IEEE
    Year: 2014
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