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Innovative Scaling Method to Minimize Cost of Integrated Circuit Packages and Devices

Type: Journal Paper

Author : Bhattacharyya, Bidyut K.; Laskar, Nivedita; Debnath, Shoubhik; Baral, Debasis

Publisher: IEEE

Year: 2014

Layout Consideration and Circuit Solution to Prevent EOS Failure Induced by Latchup Test in a High-Voltage Integrated Circuits

Type: Journal Paper

Author : Hui-Wen Tsai; Ming-Dou Ker

Publisher: IEEE

Year: 2014

Efficient UDP-based congestion aware transport for data center traffic

Type: Conference Paper

Author : Ye, Lisha; Mhamdi, Lotfi; Hamdi, Mounir

Publisher: IEEE

Year: 2014

Dynamic allocation and efficient distribution of data among multiple clouds using network coding

Type: Conference Paper

Author : Sipos, Marton; Fitzek, Frank H.P.; Lucani, Daniel E.; Pedersen, Morten V.

Publisher: IEEE

Year: 2014

S6-G4: High injection and efficiency droop in GaInN light-emitting diodes

Type: Conference Paper

Author : Lin, Guan-Bo; Meyaard, David S.; Schubert, E.Fred; Cho, Jaehee; Kim, Jong Kyu; Shim, Hyunwook; Kim, Min-Ho; Sone, Cheolsoo

Publisher: IEEE

Year: 2014

Author

Baral, Debasis (1)

Bhattacharyya, Bidyut K. (1)

Cho, Jaehee (1)

Debnath, Shoubhik (1)

Fitzek, Frank H.P. (1)

Hamdi, Mounir (1)

Hui-Wen Tsai (1)

Kim, Jong Kyu (1)

Kim, Min-Ho (1)

Laskar, Nivedita (1)

Publisher

IEEE (5)

Year

2014 (5)

Keywords

n three-dimensional integrated circuits (2)

(L) , (C) , and (R) of packages (1)

BCD process (1)

BiCMOS integrated circuits (1)

bipolar CMOS DMOS process (1)

Capacitance (1)

circuit solution (1)

Clocks (1)

cost minimization (1)

cost reduction (1)

Type

Conference Paper (3)

Journal Paper (2)

Language (ISO)

English (5)

Content Type

Metadata Only (5)

Publication Title

loud Networking (CloudNet), 2014 IEEE 3rd International Conference on (2)

Components, Packaging and Manufacturing Technology, IEEE Transactions on (1)

Device and Materials Reliability, IEEE Transactions on (1)

ester Eastman Conference on High Performance Devices (LEC), 2014 (1)

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