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    High-precision integration approach based on alignment maintaining flip-chip bonding using cone shaped bump and truncated pyramid pad 

    Type: Conference Paper
    Author : Bui Thanh Tung; Laina Ma; Amano, T.; Kikuchi, K.; Aoyagi, M.
    Publisher: IEEE
    Year: 2014

    EMIL: The energy materials in situ laboratory Berlin 

    Type: Conference Paper
    Author : Lips, K.; Starr, D.E.; Bar, M.; Schulze, T.F.; Fenske, F.; Christiansen, S.; van de Krol, R.; Raoux, S.; Reichardt, G.; Schafers, F.; Hendel, S.; Follath, R.; Bahrdt, J.; Scheer, M.; Wustefeld, G.; Kuske, P.; Havecker, M.; Knop-Gericke, A.; Schlogl, R.; Rech, B.
    Publisher: IEEE
    Year: 2014

    Automatic keyword extraction for scientific literatures using references 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Integration of perception, control and injury knowledge for safe human-robot interaction 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Real-time behaviour synthesis for dynamic hand-manipulation 

    Type: Conference Paper
    Author : Kumar, V. , Tassa, Y. , Erez, T. , Todorov, E.
    Publisher: IEEE
    Year: 2014

    Digital voltage-mode-control of a full-bridge phase-shift-modulated DC-DC converter 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Programmable Mobile Core Network 

    Type: Conference Paper
    Author : Shanmugalingam, S. , Bertin, P.
    Publisher: IEEE
    Year: 2014

    Extending producer responsibility: Framework to incorporate life cycle assessment in aircraft preliminary design based on take-back policies 

    Type: Conference Paper
    Author : Sousa Ribeiro, J. , de Oliveira Gomes, J.
    Publisher: IEEE
    Year: 2014

    Towards a conceptual semantic design for mechatronic product's family development 

    Type: Conference Paper
    Author : Diagne, S. , Coulibaly, A. , De Beuvron, F.
    Publisher: IEEE
    Year: 2014

    Structure ordering in Mg-Zn ferrite nanopowders obtained by the method of Sol-Gel autocombustion 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014
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