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Fundamental study on voltage stability of induction generators for wind power generation — Voltage-power curves for various types of generators

Type: Conference Paper

Author : Kuraishi, K.; Nanahara, T.

Publisher: IEEE

Year: 2014

Novel slurry injection system for improved slurry flow, enhanced material removal and reduced defects in CMP

Type: Conference Paper

Author : Yun Zhuang; Sampurno, Y.; Borucki, L.; Philipossian, A.

Publisher: IEEE

Year: 2014

Novel Electrical and Fluidic Microbumps for Silicon Interposer and 3-D ICs

Type: Journal Paper

Author : Li Zheng; Yue Zhang; Gang Huang; Bakir, Muhannad S.

Publisher: IEEE

Year: 2014

Pulse-Vanishing Test for Interposers Wires in 2.5-D IC

Type: Journal Paper

Author : Shi-Yu Huang; Jeo-Yen Lee; Kun-Han Tsai; Wu-Tung Cheng

Publisher: IEEE

Year: 2014

Electromigration Study for Multiscale Power/Ground Vias in TSV-Based 3-D ICs

Type: Journal Paper

Author : Jiwoo Pak; Sung Kyu Lim; Pan, David Z.

Publisher: IEEE

Year: 2014

Power management of shipboard power systems using Interaction Balance Principle

Type: Conference Paper

Author : Amgai, Ranjit; Abdelwahed, Sherif

Publisher: IEEE

Year: 2014

Fast fault location in power transmission networks using transient signatures from sparsely-placed synchrophasors

Type: Conference Paper

Author : Valdez, Justin; Zhang, Xun; Torres, Jackeline Abad; Roy, Sandip

Publisher: IEEE

Year: 2014

Cost-effective geotechnical and sedimentological early site assessment for ocean renewable energies

Type: Conference Paper

Author : Stark, Nina; Hay, Alex E.; Trowse, Greg

Publisher: IEEE

Year: 2014

Modeling of the test-fixture / Horizontal Coupling Plane interaction in system-level ESD test setups

Type: Conference Paper

Author : Tazzoli, Augusto; Malobabic, Slavica; Vashchenko, Vladislav

Publisher: IEEE

Year: 2014

Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement

Type: Journal Paper

Author : Athikulwongse, Krit; Ekpanyapong, M.; Sung Kyu Lim

Publisher: IEEE

Year: 2014

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Fundamental study on voltage stability of induction generators for wind power generation — Voltage-power curves for various types of generators

Novel slurry injection system for improved slurry flow, enhanced material removal and reduced defects in CMP

Novel Electrical and Fluidic Microbumps for Silicon Interposer and 3-D ICs

Pulse-Vanishing Test for Interposers Wires in 2.5-D IC

Electromigration Study for Multiscale Power/Ground Vias in TSV-Based 3-D ICs

Power management of shipboard power systems using Interaction Balance Principle

Fast fault location in power transmission networks using transient signatures from sparsely-placed synchrophasors

Cost-effective geotechnical and sedimentological early site assessment for ocean renewable energies

Modeling of the test-fixture / Horizontal Coupling Plane interaction in system-level ESD test setups

Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement

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Fundamental study on voltage stability of induction generators for wind power generation &#x2014; Voltage-power curves for various types of generators

Novel slurry injection system for improved slurry flow, enhanced material removal and reduced defects in CMP

Novel Electrical and Fluidic Microbumps for Silicon Interposer and 3-D ICs

Pulse-Vanishing Test for Interposers Wires in 2.5-D IC

Electromigration Study for Multiscale Power/Ground Vias in TSV-Based 3-D ICs

Power management of shipboard power systems using Interaction Balance Principle

Fast fault location in power transmission networks using transient signatures from sparsely-placed synchrophasors

Cost-effective geotechnical and sedimentological early site assessment for ocean renewable energies

Modeling of the test-fixture / Horizontal Coupling Plane interaction in system-level ESD test setups

Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement

Fundamental study on voltage stability of induction generators for wind power generation — Voltage-power curves for various types of generators