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    Very thin POP and SIP packaging approaches to achieve functionality integration prior to TSV implementation 

    Type: Conference Paper
    Author : Roa, F.
    Publisher: IEEE
    Year: 2014

    Bootstrap circuit with high-voltage charge storing for area efficient gate drivers in power management systems 

    Type: Conference Paper
    Author : Seidel, A.; Costa, M.; Joos, J.; Wicht, B.
    Publisher: IEEE
    Year: 2014

    Packaging for SiC power device 

    Type: Conference Paper
    Author : Funaki, T.
    Publisher: IEEE
    Year: 2014

    Tutorial T6A: Pedagogy of Negative Feedback Circuits 

    Type: Conference Paper
    Author : Krishnapura, N.
    Year: 2014

    Caracterización de sensores planos de polímero piezoeléctrico para tomografía optoacústica 

    Type: Conference Paper
    Author : Gonzalez, M. , Sorichetti, P. , Santiago, G.
    Publisher: IEEE
    Year: 2014

    Contents 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Soft Consistency Reconstruction: A robust 1-bit compressive sensing algorithm 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Secrecy in MIMOME wiretap channels: Beamforming with imperfect CSI 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    A survey of RDF store solutions 

    Type: Conference Paper
    Author : Modoni, G.E. , Sacco, M. , Terkaj, W.
    Publisher: IEEE
    Year: 2014

    Permission-combination-based scheme for Android mobile malware detection 

    Type: Conference Paper
    Author : Shuang Liang , Xiaojiang Du
    Publisher: IEEE
    Year: 2014
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