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Globally Constrained Locally Optimized 3-D Power Delivery Networks

Type: Journal Paper

Author : Todri-Sanial, Aida; Kundu, Sandipan; Girard, P.; Bosio, A.; Dilillo, L.; Virazel, A.

Publisher: IEEE

Year: 2014

Power-aware floorplanning-based power throughsilicon- via technology and bump minimisation for three-dimensional power delivery network

Type: Journal Paper

Author : Cheoljon Jang; Jaehwan Kim; Jongwha Chong

Publisher: IET

Year: 2014

Influence of dispersion earth resistance variation on the consumers operation

Type: Conference Paper

Author : Abagiu, Sorin; Lepadat, Ionel; Helerea, Elena

Publisher: IEEE

Year: 2014

Motion monitoring in palliative care using unobtrusive bed sensors

Type: Conference Paper

Author : Holtzman, M.; Goubran, R.; Knoefel, F.

Publisher: IEEE

Year: 2014

Author

Abagiu, Sorin (1)

Bosio, A. (1)

Cheoljon Jang (1)

Dilillo, L. (1)

Girard, P. (1)

Goubran, R. (1)

Helerea, Elena (1)

Holtzman, M. (1)

Jaehwan Kim (1)

Jongwha Chong (1)

Publisher

IEEE (3)

IET (1)

Year

2014 (4)

Keywords

3D integrated circuits (2)

n 3D IC (2)

n 3D power delivery network (2)

n three-dimensional integrated circuits (2)

three-dimensional integrated circuits (2)

2D planar chips (1)

3D PDN (1)

3D power delivery network (1)

3D power delivery networks (1)

Algorithms (1)

Type

Conference Paper (2)

Journal Paper (2)

Language (ISO)

English (4)

Content Type

Metadata Only (4)

Publication Title

Computers &amp; Digital Techniques, IET (1)

ngineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the (1)

pplied and Theoretical Electricity (ICATE), 2014 International Conference on (1)

Very Large Scale Integration (VLSI) Systems, IEEE Transactions on (1)

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