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Integrated converter modeling for medium voltage DC shipboard distribution system simulation

Type: Conference Paper

Author : Qi, L.; Pan, J.; Daniel, J.; Apeldoorn, O.; Li, J.; Wang, Z.

Publisher: IEEE

Year: 2014

Novel slurry injection system for improved slurry flow, enhanced material removal and reduced defects in CMP

Type: Conference Paper

Author : Yun Zhuang; Sampurno, Y.; Borucki, L.; Philipossian, A.

Publisher: IEEE

Year: 2014

A multipath delay estimation model and algorithm in OFDM systems

Type: Conference Paper

Publisher: IEEE

Year: 2014

Liveness detection of dorsal hand vein based on AutoRegressive model

Type: Conference Paper

Author : Yiding Wang; Qi Qi; Kefeng Li

Publisher: IEEE

Year: 2014

Hue modification estimation using sensor pattern noise

Type: Conference Paper

Author : Hou, Jong-Uk; Jang, Han-Ul; Lee, Heung-Kyu

Publisher: IEEE

Year: 2014

Author

Apeldoorn, O. (1)

Borucki, L. (1)

Daniel, J. (1)

Hou, Jong-Uk (1)

Jang, Han-Ul (1)

Kefeng Li (1)

Lee, Heung-Kyu (1)

Li, J. (1)

Pan, J. (1)

Philipossian, A. (1)

Publisher

IEEE (5)

Year

2014 (5)

Keywords

3D assembly (2)

n 3D assembly (2)

n Assembly (2)

n three-dimensional integrated circuits (2)

ANSYS software (1)

assembling (1)

bonding current (1)

bonding process (1)

bonding time (1)

copper (1)

Type

Conference Paper (5)

Language (ISO)

English (5)

Content Type

Metadata Only (5)

Publication Title

ES General Meeting | Conference &amp; Exposition, 2014 IEEE (1)

lanarization/CMP Technology (ICPT), 2014 International Conference on (1)

mage Processing (ICIP), 2014 IEEE International Conference on (1)

nformation Science and Technology (ICIST), 2014 4th IEEE International Conference on (1)

omputing, Communications and IT Applications Conference (ComComAp), 2014 IEEE (1)

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