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Now showing items 1-8 of 8
Low-Cost Post-Bond Testing of 3-D ICs Containing a Passive Silicon Interposer Base
Publisher: IEEE
Year: 2014
Evaluating the requirements of patients with heart diseases in a telehealthcare service
Publisher: IEEE
Year: 2014
Analysis of leakage current and leakage power reduction during write operation in CMOS SRAM cell
Publisher: IEEE
Year: 2014
Untitled
Publisher: IEEE
Year: 2014
An alive electroencephalogram analysis system to assist the diagnosis of epilepsy
Publisher: IEEE
Year: 2014
A Semi-Analytical Thermal Modeling Framework for Liquid-Cooled ICs
Publisher: IEEE
Year: 2014