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contributor authorChang Hao , Liang Huaguo , Li Yang , Ouyang Yiming
date accessioned2020-03-12T19:51:16Z
date available2020-03-12T19:51:16Z
date issued2014
identifier other6834877.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/992582?show=full
formatgeneral
languageEnglish
publisherIEEE
titleOptimized stacking order for 3D-stacked ICs considering the probability and cost of failed bonding
typeConference Paper
contenttypeMetadata Only
identifier padid8111685
subject keywordsCarbon nanotubes
subject keywordsLaboratories
subject keywordsMaterials
subject keywordsNanomaterials
subject keywordsProtocols
subject keywordsSafety
subject keywordsSafety handling
subject keywordscarbon nanotubes
subject keywordsnanotechnology
subject keywordsoccupational health
subject keywordsrisk management
identifier doi10.1109/IBERSENSOR.2014.6995538
journal titleLSI Design, Automation and Test (VLSI-DAT), 2014 International Symposium on
filesize557784
citations0


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