Cu pattern etching by oxygen gas cluster ion beams with acetic acid vapor
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: 2014DOI: 10.1109/POWERCON.2014.6993481
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Cu pattern etching by oxygen gas cluster ion beams with acetic acid vapor
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| date accessioned | 2020-03-12T19:51:04Z | |
| date available | 2020-03-12T19:51:04Z | |
| date issued | 2014 | |
| identifier other | 6831879.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/992445 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Cu pattern etching by oxygen gas cluster ion beams with acetic acid vapor | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8111531 | |
| subject keywords | Facsimile | |
| identifier doi | 10.1109/POWERCON.2014.6993481 | |
| journal title | nterconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE Internat | |
| filesize | 538439 | |
| citations | 0 | |
| contributor rawauthor | Toyoda, N. , Kojima, M. , Hinoura, R. , Yamaguchi, A. , Hara, K. , Yamada, I. |