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Understanding delamination for fast development of reliable packages for automotive applications. A consideration of robustness for new packages based on simulation

Author:
Pufall, R. , Goroll, M. , Reuther, G.M.
Publisher:
IEEE
Year
: 2014
DOI: 10.1109/ECOC.2014.6964007
URI: https://libsearch.um.ac.ir:443/fum/handle/fum/988285
Keyword(s): compensation,optical fibre communication,optical modulation,quadrature amplitude modulation,quadrature phase shift keying,16QAM,QPSK transmission,SSMF,fiber nonlinearity compensation,filter length calculation,location independent NLC,Finite impulse response filters,Optical fiber dispersion,Optical fiber filters,Optical noise,Phase shift keying,Signal to noise ratio
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    Understanding delamination for fast development of reliable packages for automotive applications. A consideration of robustness for new packages based on simulation

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contributor authorPufall, R. , Goroll, M. , Reuther, G.M.
date accessioned2020-03-12T19:44:32Z
date available2020-03-12T19:44:32Z
date issued2014
identifier other6813784.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/988285
formatgeneral
languageEnglish
publisherIEEE
titleUnderstanding delamination for fast development of reliable packages for automotive applications. A consideration of robustness for new packages based on simulation
typeConference Paper
contenttypeMetadata Only
identifier padid8104416
subject keywordscompensation
subject keywordsoptical fibre communication
subject keywordsoptical modulation
subject keywordsquadrature amplitude modulation
subject keywordsquadrature phase shift keying
subject keywords16QAM
subject keywordsQPSK transmission
subject keywordsSSMF
subject keywordsfiber nonlinearity compensation
subject keywordsfilter length calculation
subject keywordslocation independent NLC
subject keywordsFinite impulse response filters
subject keywordsOptical fiber dispersion
subject keywordsOptical fiber filters
subject keywordsOptical noise
subject keywordsPhase shift keying
subject keywordsSignal to noise ratio
identifier doi10.1109/ECOC.2014.6964007
journal titlehermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems
filesize1917693
citations0
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