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A thermal and congestion driven global router for 3D integrated circuits

contributor authorRoy, D. , Ghosal, P. , Das, N.
date accessioned2020-03-12T19:43:34Z
date available2020-03-12T19:43:34Z
date issued2014
identifier other6808065.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/987664?show=full
formatgeneral
languageEnglish
publisherIEEE
titleA thermal and congestion driven global router for 3D integrated circuits
typeConference Paper
contenttypeMetadata Only
identifier padid8103691
subject keywordsBoltzmann machines
subject keywordsbuilding management systems
subject keywordscooling
subject keywordsdemand side management
subject keywordsheating
subject keywordslearning (artificial intelligence)
subject keywordspower consumption
subject keywordspower engineering computing
subject keywordspower grids
subject keywordsstochastic processes
subject keywordstime series
subject keywordsANN
subject keywordsCRBM
subject keywordsDutch office building
subject keywordsHMM
subject keywordsartificial neural networks
subject keywordsautomated methods
subject keywordsbuilding automation system
subject keywordsbuilding energy consumption estimation
subject keywordsconditional restricted Boltzmann machine
subject keywordscooling system
subject keywordsdecentralized renewable energy sources
subject keywordselectricity consumption
identifier doi10.1109/PMAPS.2014.6960635
journal titletudents' Technology Symposium (TechSym), 2014 IEEE
filesize982077
citations0


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