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Efficient transient thermal simulation of 3D ICs with liquid-cooling and through silicon vias

contributor authorFourmigue, A. , Beltrame, G. , Nicolescu, G.
date accessioned2020-03-12T19:40:22Z
date available2020-03-12T19:40:22Z
date issued2014
identifier other6800288.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/985690?show=full
formatgeneral
languageEnglish
publisherIEEE
titleEfficient transient thermal simulation of 3D ICs with liquid-cooling and through silicon vias
typeConference Paper
contenttypeMetadata Only
identifier padid8101371
subject keywordsclocks
subject keywordsdelta-sigma modulation
subject keywordserrors
subject keywordstransfer functions
subject keywordscircuit simulation technique
subject keywordscontinuous time delta-sigma modulator
subject keywordshigh-speed continuous time systems
subject keywordshigh-speed delta-sigma modulator
subject keywordsinternal flash ADC
subject keywordsmaximum clock rate
subject keywordsmetastability error
subject keywordsmodulator transfer function
subject keywordssignal-to-noise ratio
subject keywordsAsh
subject keywordsBandwidth
subject keywordsClocks
subject keywordsDelays
subject keywordsGain
subject keywordsModulation
subject keywordsNoise
identifier doi10.1109/CICC.2014.6945987
journal titleesign, Automation and Test in Europe Conference and Exhibition (DATE), 2014
filesize725334
citations0


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