Parametric Fault Testing and Performance Characterization of Post-Bond Interposer Wires in 2.5-D ICs
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: 2014DOI: 10.1109/TCAD.2013.2290589
Keyword(s): elemental semiconductors,fault diagnosis,integrated circuit testing,silicon,three-dimensional integrated circuits,2.5D ICs,2.5D stacked integrated circuit,Si,catastrophic faults,fault-free interposer wire,hard bridging faults,interposer wire testing,parametric fault testing,performance characterization,post-bond interposer wires,propagation delay,resistive bridging faults,resistive open faults,silicon debug,stuck-at faults,yield learning,Circuit faults,Delays,Integrated ci
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Parametric Fault Testing and Performance Characterization of Post-Bond Interposer Wires in 2.5-D ICs
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| contributor author | Li-Ren Huang | |
| contributor author | Shi-Yu Huang | |
| contributor author | Kun-Han Tsai | |
| contributor author | Wu-Tung Cheng | |
| date accessioned | 2020-03-12T18:46:31Z | |
| date available | 2020-03-12T18:46:31Z | |
| date issued | 2014 | |
| identifier issn | 0278-0070 | |
| identifier other | 6740056.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/969750 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Parametric Fault Testing and Performance Characterization of Post-Bond Interposer Wires in 2.5-D ICs | |
| type | Journal Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8004098 | |
| subject keywords | elemental semiconductors | |
| subject keywords | fault diagnosis | |
| subject keywords | integrated circuit testing | |
| subject keywords | silicon | |
| subject keywords | three-dimensional integrated circuits | |
| subject keywords | 2.5D ICs | |
| subject keywords | 2.5D stacked integrated circuit | |
| subject keywords | Si | |
| subject keywords | catastrophic faults | |
| subject keywords | fault-free interposer wire | |
| subject keywords | hard bridging faults | |
| subject keywords | interposer wire testing | |
| subject keywords | parametric fault testing | |
| subject keywords | performance characterization | |
| subject keywords | post-bond interposer wires | |
| subject keywords | propagation delay | |
| subject keywords | resistive bridging faults | |
| subject keywords | resistive open faults | |
| subject keywords | silicon debug | |
| subject keywords | stuck-at faults | |
| subject keywords | yield learning | |
| subject keywords | Circuit faults | |
| subject keywords | Delays | |
| subject keywords | Integrated ci | |
| identifier doi | 10.1109/TCAD.2013.2290589 | |
| journal title | Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on | |
| journal volume | 33 | |
| journal issue | 3 | |
| filesize | 1838578 | |
| citations | 0 |