Globally Constrained Locally Optimized 3-D Power Delivery Networks
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: 2014شناسه الکترونیک: 10.1109/TVLSI.2013.2283800
کلیدواژه(گان): circuit optimisation,current density,electromigration,integrated circuit interconnections,three-dimensional integrated circuits,3D PDN,3D integrated circuits,3D power delivery networks,TSV,bridge power lines,constrained optimization problem,current density constraints,electromigration limit,heat flux,power grid optimization solution,through-silicon via,Analytical models,Capacitance,Heat sinks,Integrated circuit modeling,Metals,Resistance,Temperature measurement,Algorithms
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Globally Constrained Locally Optimized 3-D Power Delivery Networks
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| contributor author | Todri-Sanial, Aida | |
| contributor author | Kundu, Sandipan | |
| contributor author | Girard, P. | |
| contributor author | Bosio, A. | |
| contributor author | Dilillo, L. | |
| contributor author | Virazel, A. | |
| date accessioned | 2020-03-12T18:30:27Z | |
| date available | 2020-03-12T18:30:27Z | |
| date issued | 2014 | |
| identifier issn | 1063-8210 | |
| identifier other | 6637102.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/960809 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Globally Constrained Locally Optimized 3-D Power Delivery Networks | |
| type | Journal Paper | |
| contenttype | Metadata Only | |
| identifier padid | 7993512 | |
| subject keywords | circuit optimisation | |
| subject keywords | current density | |
| subject keywords | electromigration | |
| subject keywords | integrated circuit interconnections | |
| subject keywords | three-dimensional integrated circuits | |
| subject keywords | 3D PDN | |
| subject keywords | 3D integrated circuits | |
| subject keywords | 3D power delivery networks | |
| subject keywords | TSV | |
| subject keywords | bridge power lines | |
| subject keywords | constrained optimization problem | |
| subject keywords | current density constraints | |
| subject keywords | electromigration limit | |
| subject keywords | heat flux | |
| subject keywords | power grid optimization solution | |
| subject keywords | through-silicon via | |
| subject keywords | Analytical models | |
| subject keywords | Capacitance | |
| subject keywords | Heat sinks | |
| subject keywords | Integrated circuit modeling | |
| subject keywords | Metals | |
| subject keywords | Resistance | |
| subject keywords | Temperature measurement | |
| subject keywords | Algorithms | |
| identifier doi | 10.1109/TVLSI.2013.2283800 | |
| journal title | Very Large Scale Integration (VLSI) Systems, IEEE Transactions on | |
| journal volume | 22 | |
| journal issue | 10 | |
| filesize | 2803053 | |
| citations | 0 |