| contributor author | مجتبی جودکی | en |
| contributor author | Günter Kompa | en |
| contributor author | Hartmut Hillmer | en |
| contributor author | Rainer Kassing | en |
| contributor author | Mojtaba Joodaki | fa |
| date accessioned | 2020-06-06T13:14:50Z | |
| date available | 2020-06-06T13:14:50Z | |
| date issued | 2005 | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/3347467?show=full | |
| description abstract | Static thermal analyses for the earlier concept and the enhanced quasi-monolithic integration technology (QMIT) are performed in detail. The effects of several parameters such as the properties of the materials involved and different geometries in all possible structures are described. Simulation results confirm a very low thermal resistance for the enhanced QMIT structure and highlight its superiority to the earlier concept of QMIT structures. This leads to a longer lifetime, a higher reliability and a better performance of the packaging. | en |
| language | English | |
| title | Heat transfer improvement in quasi-monolithic integration technology | en |
| type | Journal Paper | |
| contenttype | External Fulltext | |
| subject keywords | Epoxies | en |
| subject keywords | Gallium arsenide | en |
| subject keywords | Simulations | en |
| subject keywords | Resistance | en |
| journal title | Journal of Microlithography Microfabrication and Microsystems | fa |
| pages | 33011-33011 | |
| journal volume | 4 | |
| journal issue | 3 | |
| identifier link | https://profdoc.um.ac.ir/paper-abstract-1037009.html | |
| identifier articleid | 1037009 | |
