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Influence of Thermal Cycle Frequency on the TGO Growth and Cracking Behaviors of an APS-TBC

Author:
W. R. Chen, X. Wu, D. Dudzinski
Year
: 2012
DOI: 10.1007/s11666-012-9824-4
URI: https://libsearch.um.ac.ir:443/fum/handle/fum/1762723
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    Influence of Thermal Cycle Frequency on the TGO Growth and Cracking Behaviors of an APS-TBC

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contributor authorW. R. Chen, X. Wu, D. Dudzinski
date accessioned2020-03-14T22:01:37Z
date available2020-03-14T22:01:37Z
date issued2012
identifier other5H82ejysuy9PYOVEVr1aBYvUCNfaJctzNQwGvTgelc5i8mTKgk.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1762723
formatgeneral
languageEnglish
titleInfluence of Thermal Cycle Frequency on the TGO Growth and Cracking Behaviors of an APS-TBC
typeJournal Paper
contenttypeFulltext
contenttypeFulltext
identifier padid12524358
identifier doi10.1007/s11666-012-9824-4
coverageAcademic
journal volume21
journal issue6
filesize770436
citations0
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