Near-Field and Far-Field Analyses of Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure for Mixed-Signal Applications
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: 2007DOI: 10.1109/TADVP.2007.896921
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Near-Field and Far-Field Analyses of Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure for Mixed-Signal Applications
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| contributor author | Jinwoo Choi | |
| contributor author | Dong Gun Kam | |
| contributor author | Daehyun Chung | |
| contributor author | Krishna Srinivasan | |
| contributor author | Vinu Govind | |
| contributor author | Joungho Kim | |
| contributor author | Madhavan Swaminathan | |
| date accessioned | 2020-03-14T16:37:02Z | |
| date available | 2020-03-14T16:37:02Z | |
| date issued | 2007 | |
| identifier other | IiTXoyZn8NumxqgvR523grp7ER5tK_Hrywci_upzmfIcGe4tuL.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1698125?locale-attribute=en | |
| format | general | |
| language | English | |
| title | Near-Field and Far-Field Analyses of Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure for Mixed-Signal Applications | |
| type | Journal Paper | |
| contenttype | Fulltext | |
| contenttype | Fulltext | |
| identifier padid | 12137225 | |
| identifier doi | 10.1109/TADVP.2007.896921 | |
| journal title | IEEE Transactions on Advanced Packaging | |
| coverage | Academic | |
| pages | 180-190 | |
| journal volume | 30 | |
| journal issue | 2 | |
| filesize | 1841643 | |
| citations | 4 |