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Study on Transmission Characteristics of Carbon Nanotube Through Silicon Via Interconnect

contributor authorLibo Qian
contributor authorZhangming Zhu
contributor authorYinshui Xia
date accessioned2020-03-13T00:26:40Z
date available2020-03-13T00:26:40Z
date issued2014
identifier issn1531-1309
identifier other6930830.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1146968?show=full
formatgeneral
languageEnglish
publisherIEEE
titleStudy on Transmission Characteristics of Carbon Nanotube Through Silicon Via Interconnect
typeJournal Paper
contenttypeMetadata Only
identifier padid8329879
subject keywordscarbon nanotubes
subject keywordscircuit optimisation
subject keywordsintegrated circuit interconnections
subject keywordsintegrated circuit modelling
subject keywordsmatrix algebra
subject keywordsthree-dimensional integrated circuits
subject keywordstransmission lines
subject keywordsABCD matrix
subject keywordsCNT-TSV
subject keywordsRLCG parameters
subject keywordsSPICE
subject keywordsTL model
subject keywordsTSV transmission characteristics
subject keywordsair gap insulator
subject keywordscarbon nanotube through silicon via interconnect
subject keywordseye open area
subject keywordsgeometrical parameters
subject keywordsinsertion loss reduction
subject keywordsmaterial parameters
subject keywordsoptimization methodology
subject keywordsresistance inductance capacitance conductance p
identifier doi10.1109/LMWC.2014.2361429
journal titleMicrowave and Wireless Components Letters, IEEE
journal volume24
journal issue12
filesize620534
citations0


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