Feature-Based Object Location of IC Pins by Using Fast Run Length Encoding BLOB Analysis
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سال
: 2014شناسه الکترونیک: 10.1109/TCPMT.2014.2350015
کلیدواژه(گان): encoding,inspection,integrated circuit packaging,labelling (packaging),BLOB analysis,BLOB-linked list,RLE,binary large object analysis,connectivity branches,fast run length encoding,feature-based object location,integrated circuit packaging inspection,integrated circuit pins,labeling conflicts,small outline packaging,Algorithm design and analysis,Data structures,Feature extraction,Image segmentation,Inspection,Integrated circuits,Pins,Binary large object (BLOB) analysis,fe
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آمار بازدید
Feature-Based Object Location of IC Pins by Using Fast Run Length Encoding BLOB Analysis
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| contributor author | Qiusheng Zhong | |
| contributor author | Zhong Chen | |
| contributor author | Xianmin Zhang | |
| contributor author | Guanghua Hu | |
| date accessioned | 2020-03-13T00:21:33Z | |
| date available | 2020-03-13T00:21:33Z | |
| date issued | 2014 | |
| identifier issn | 2156-3950 | |
| identifier other | 6894154.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1143754 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Feature-Based Object Location of IC Pins by Using Fast Run Length Encoding BLOB Analysis | |
| type | Journal Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8326392 | |
| subject keywords | encoding | |
| subject keywords | inspection | |
| subject keywords | integrated circuit packaging | |
| subject keywords | labelling (packaging) | |
| subject keywords | BLOB analysis | |
| subject keywords | BLOB-linked list | |
| subject keywords | RLE | |
| subject keywords | binary large object analysis | |
| subject keywords | connectivity branches | |
| subject keywords | fast run length encoding | |
| subject keywords | feature-based object location | |
| subject keywords | integrated circuit packaging inspection | |
| subject keywords | integrated circuit pins | |
| subject keywords | labeling conflicts | |
| subject keywords | small outline packaging | |
| subject keywords | Algorithm design and analysis | |
| subject keywords | Data structures | |
| subject keywords | Feature extraction | |
| subject keywords | Image segmentation | |
| subject keywords | Inspection | |
| subject keywords | Integrated circuits | |
| subject keywords | Pins | |
| subject keywords | Binary large object (BLOB) analysis | |
| subject keywords | fe | |
| identifier doi | 10.1109/TCPMT.2014.2350015 | |
| journal title | Components, Packaging and Manufacturing Technology, IEEE Transactions on | |
| journal volume | 4 | |
| journal issue | 11 | |
| filesize | 6942649 | |
| citations | 0 |