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Modal Analysis of Substrate Integrated Waveguides With Rectangular Via-Holes Using Cavity and Multilayer Green's Functions

contributor authorKehn, Malcolm Ng Mou
date accessioned2020-03-13T00:17:47Z
date available2020-03-13T00:17:47Z
date issued2014
identifier issn0018-9480
identifier other6874592.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1141470?locale-attribute=fa&show=full
formatgeneral
languageEnglish
publisherIEEE
titleModal Analysis of Substrate Integrated Waveguides With Rectangular Via-Holes Using Cavity and Multilayer Green's Functions
typeJournal Paper
contenttypeMetadata Only
identifier padid8323907
subject keywordsGreen'
subject keywordss function methods
subject keywordsdielectric losses
subject keywordsgraph theory
subject keywordsmodal analysis
subject keywordsmode matching
subject keywordsspectral analysis
subject keywordssubstrate integrated waveguides
subject keywordsconductor losses
subject keywordsdielectric losses
subject keywordshard sidewalled SIW
subject keywordsindependent commercial full-wave solver
subject keywordsmodal dispersion graphs
subject keywordsmode-matching technique
subject keywordsmultilayer Green functions
subject keywordsplanar multilayer structures
subject keywordsrectangular cavities
subject keywordsrectangular via-holes
subject keywordsside-leakage losses
subject keywordsspectral domain
subject keywordssubstrate integrated waveguides
subject keywordsApertures
subject keywordsCavity resonators
identifier doi10.1109/TMTT.2014.2344626
journal titleMicrowave Theory and Techniques, IEEE Transactions on
journal volume62
journal issue10
filesize6071138
citations0


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