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Electromigration testing of wire bonds

contributor authorHook, M. , Di Xu , Mayer, M.
date accessioned2020-03-12T23:36:24Z
date available2020-03-12T23:36:24Z
date issued2014
identifier other6901111.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1117675?show=full
formatgeneral
languageEnglish
publisherIEEE
titleElectromigration testing of wire bonds
typeConference Paper
contenttypeMetadata Only
identifier padid8287459
subject keywordsimage registration
subject keywordsmobile robots
subject keywordspath planning
subject keywordsrobot vision
subject keywordssensor fusion
subject keywords3D range data
subject keywordsautonomous robot exploration
subject keywordseye-in-hand configuration
subject keywordsglobal registration
subject keywordsmidrange 3D observation
subject keywordsnext best view planning
subject keywordspoint cloud model
subject keywordsrange sensor
subject keywordsrobot arm
subject keywordssensor fusion
subject keywordsvolumetric representation
subject keywordsAlgorithm design and analysis
subject keywordsManipulators
subject keywordsPlanning
subject keywordsRobot sensing systems
subject keywordsThree-dimensional displays
identifier doi10.1109/IROS.2014.6943077
journal titlelectrical and Computer Engineering (CCECE), 2014 IEEE 27th Canadian Conference on
filesize8859335
citations0


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