Identification of Cu-Al intermetallic phases of copper wire bonding using TEM nano beam diffraction indexing technique
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: 2014DOI: 10.1109/CIPECH.2014.7018211
Keyword(s): Bandwidth,Frequency response,Logic gates,Low voltage,MOSFET,Threshold voltage,Dynamic threshold MOS Transistor,analog integrated circuits,bandwidth,low voltage,voltage follower
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Identification of Cu-Al intermetallic phases of copper wire bonding using TEM nano beam diffraction indexing technique
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| contributor author | Yong, F.K. | |
| date accessioned | 2020-03-12T23:32:42Z | |
| date available | 2020-03-12T23:32:42Z | |
| date issued | 2014 | |
| identifier other | 6898172.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1115490 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Identification of Cu-Al intermetallic phases of copper wire bonding using TEM nano beam diffraction indexing technique | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8284944 | |
| subject keywords | Bandwidth | |
| subject keywords | Frequency response | |
| subject keywords | Logic gates | |
| subject keywords | Low voltage | |
| subject keywords | MOSFET | |
| subject keywords | Threshold voltage | |
| subject keywords | Dynamic threshold MOS Transistor | |
| subject keywords | analog integrated circuits | |
| subject keywords | bandwidth | |
| subject keywords | low voltage | |
| subject keywords | voltage follower | |
| identifier doi | 10.1109/CIPECH.2014.7018211 | |
| journal title | hysical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium o | |
| filesize | 2355991 | |
| citations | 0 |