Effects of sidewall scallops on the performance and reliability of filled copper and open tungsten TSVs
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: 2014DOI: 10.1109/ECCE.2014.6953412
Keyword(s): Automotive engineering,Capacitors,Inductors,Switches,Switching loss,Topology,Windings
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Effects of sidewall scallops on the performance and reliability of filled copper and open tungsten TSVs
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| contributor author | Filipovic, L. , de Orio, R.L. , Selberherr, S. | |
| date accessioned | 2020-03-12T23:32:39Z | |
| date available | 2020-03-12T23:32:39Z | |
| date issued | 2014 | |
| identifier other | 6898137.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1115455 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Effects of sidewall scallops on the performance and reliability of filled copper and open tungsten TSVs | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8284904 | |
| subject keywords | Automotive engineering | |
| subject keywords | Capacitors | |
| subject keywords | Inductors | |
| subject keywords | Switches | |
| subject keywords | Switching loss | |
| subject keywords | Topology | |
| subject keywords | Windings | |
| identifier doi | 10.1109/ECCE.2014.6953412 | |
| journal title | hysical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium o | |
| filesize | 5423179 | |
| citations | 0 |