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Interfacial reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn solder under space confinement for 3D IC micro joint applications

contributor authorYang, T.L. , Shih, W.L. , Yu, J.J. , Kao, C.R.
date accessioned2020-03-12T23:32:37Z
date available2020-03-12T23:32:37Z
date issued2014
identifier other6897622.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1115432?locale-attribute=fa&show=full
formatgeneral
languageEnglish
publisherIEEE
titleInterfacial reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn solder under space confinement for 3D IC micro joint applications
typeConference Paper
contenttypeMetadata Only
identifier padid8284873
subject keywordsGaussian processes
subject keywordslearning (artificial intelligence)
subject keywordsmanipulators
subject keywordsprincipal component analysis
subject keywordsGP classifier
subject keywordsGaussian process algorithms
subject keywordsGaussian process-based grasp predictor
subject keywordsautomatic robotic grasping
subject keywordsdiscriminative grasp metrics
subject keywordsmachine learning techniques
subject keywordsphysical robotic platform
subject keywordsprincipal component analysis
subject keywordsstatistical analysis
subject keywordsFingers
subject keywordsGrasping
subject keywordsMachine learning algorithms
subject keywordsMeasurement
subject keywordsPrediction algorithms
subject keywordsPrincipal component analysis
subject keywordsRobots
identifier doi10.1109/IROS.2014.6943029
journal titlelectronic Components and Technology Conference (ECTC), 2014 IEEE 64th
filesize938257
citations0


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