Modeling for reliability of ultra thin chips in a system in package
| contributor author | Qian, R. , Yong Liu | |
| date accessioned | 2020-03-12T23:32:34Z | |
| date available | 2020-03-12T23:32:34Z | |
| date issued | 2014 | |
| identifier other | 6897586.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1115400?show=full | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Modeling for reliability of ultra thin chips in a system in package | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8284838 | |
| subject keywords | Computer hacking | |
| subject keywords | Encoding | |
| subject keywords | Hardware | |
| subject keywords | Redundancy | |
| subject keywords | Registers | |
| subject keywords | Safety | |
| subject keywords | Arithmetic Codes | |
| subject keywords | Encoded Processing | |
| subject keywords | Fault-tolerance | |
| subject keywords | SIHFT | |
| identifier doi | 10.1109/SRDS.2014.62 | |
| journal title | lectronic Components and Technology Conference (ECTC), 2014 IEEE 64th | |
| filesize | 2500201 | |
| citations | 0 |
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