Show simple item record

Non-destructive crack and defect detection in SAC solder interconnects using cross-sectioning and X-ray micro-CT

date accessioned2020-03-12T23:32:24Z
date available2020-03-12T23:32:24Z
date issued2014
identifier other6897484.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1115300?show=full
formatgeneral
languageEnglish
publisherIEEE
titleNon-destructive crack and defect detection in SAC solder interconnects using cross-sectioning and X-ray micro-CT
typeConference Paper
contenttypeMetadata Only
identifier padid8284720
subject keywordsComputer aided instruction
subject keywordsHospitals
subject keywordsMobile handsets
subject keywordsProfessional activities
subject keywordsSoftware
subject keywordscommunication process
subject keywordse-health
subject keywordsnatural interaction
subject keywordsnomadic workers
identifier doi10.1109/SMC.2014.6974442
journal titlelectronic Components and Technology Conference (ECTC), 2014 IEEE 64th
filesize2826247
citations0
contributor rawauthorLall, P. , Deshpande, S. , Junchao Wei , Suhling, J.


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following Collection(s)

Show simple item record