Coreless substrate with asymmetric design to improve package warpage
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ناشر:
سال
: 2014شناسه الکترونیک: 10.1109/ICIP.2014.7025674
کلیدواژه(گان): Accuracy,Estimation,Head,Joints,Magnetic heads,Pattern recognition,Visualization,Head pose estimation,joint estimation,low resolution,visual focus of attention
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Coreless substrate with asymmetric design to improve package warpage
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| contributor author | Wei Lin , Baloglu, B. , Stratton, K. | |
| date accessioned | 2020-03-12T23:32:23Z | |
| date available | 2020-03-12T23:32:23Z | |
| date issued | 2014 | |
| identifier other | 6897476.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1115292 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Coreless substrate with asymmetric design to improve package warpage | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8284712 | |
| subject keywords | Accuracy | |
| subject keywords | Estimation | |
| subject keywords | Head | |
| subject keywords | Joints | |
| subject keywords | Magnetic heads | |
| subject keywords | Pattern recognition | |
| subject keywords | Visualization | |
| subject keywords | Head pose estimation | |
| subject keywords | joint estimation | |
| subject keywords | low resolution | |
| subject keywords | visual focus of attention | |
| identifier doi | 10.1109/ICIP.2014.7025674 | |
| journal title | lectronic Components and Technology Conference (ECTC), 2014 IEEE 64th | |
| filesize | 1004594 | |
| citations | 0 |