Fabrication and reliability evaluation of a novel package-on-package (PoP) structure based on organic substrate
| contributor author | Xiaofeng Sun , Lixi Wan , Yuan Lu | |
| date accessioned | 2020-03-12T23:32:23Z | |
| date available | 2020-03-12T23:32:23Z | |
| date issued | 2014 | |
| identifier other | 6897468.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1115284?locale-attribute=fa&show=full | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Fabrication and reliability evaluation of a novel package-on-package (PoP) structure based on organic substrate | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8284704 | |
| subject keywords | Databases | |
| subject keywords | Electronic mail | |
| subject keywords | Organizations | |
| subject keywords | Personnel | |
| subject keywords | Security | |
| subject keywords | Software | |
| subject keywords | Steel | |
| subject keywords | HRMS | |
| subject keywords | RDCIS | |
| subject keywords | SAIL | |
| identifier doi | 10.1109/ICIT.2014.31 | |
| journal title | lectronic Components and Technology Conference (ECTC), 2014 IEEE 64th | |
| filesize | 2662866 | |
| citations | 0 |
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