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Experimental demonstration of the effect of copper TPVs (Through package vias) on thermal performance of glass interposers

date accessioned2020-03-12T23:32:21Z
date available2020-03-12T23:32:21Z
date issued2014
identifier other6897451.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1115268?show=full
formatgeneral
languageEnglish
publisherIEEE
titleExperimental demonstration of the effect of copper TPVs (Through package vias) on thermal performance of glass interposers
typeConference Paper
contenttypeMetadata Only
identifier padid8284686
subject keywordsAntenna arrays
subject keywordsAntenna feeds
subject keywordsAntenna measurements
subject keywordsAntenna radiation patterns
subject keywordsArrays
subject keywordsDielectrics
subject keywordsImaging
subject keywordsactive imaging system
subject keywordsantenna array
subject keywordsdielectric waveguide antenna
subject keywordsmillimeter wave
subject keywordswideband antenna
identifier doi10.1109/EuRAD.2014.6991275
journal titlelectronic Components and Technology Conference (ECTC), 2014 IEEE 64th
filesize2970823
citations0
contributor rawauthorSangbeom Cho , Sato, Y. , Sundaram, V. , Joshi, Y. , Tummala, R.


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