Enabling of Fan-Out WLP for more demanding applications by introduction of enhanced dielectric material for higher reliability
| date accessioned | 2020-03-12T23:32:15Z | |
| date available | 2020-03-12T23:32:15Z | |
| date issued | 2014 | |
| identifier other | 6897400.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1115217?show=full | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Enabling of Fan-Out WLP for more demanding applications by introduction of enhanced dielectric material for higher reliability | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8284632 | |
| subject keywords | Cameras | |
| subject keywords | Cloud computing | |
| subject keywords | Color | |
| subject keywords | Feature extraction | |
| subject keywords | Interactive systems | |
| subject keywords | Mobile communication | |
| subject keywords | Phantoms | |
| subject keywords | cloud computing | |
| subject keywords | interactive augmented reality (AR) system | |
| subject keywords | particle filter | |
| identifier doi | 10.1109/WCNC.2014.6953084 | |
| journal title | lectronic Components and Technology Conference (ECTC), 2014 IEEE 64th | |
| filesize | 1014411 | |
| citations | 0 |
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