| date accessioned | 2020-03-12T23:32:09Z | |
| date available | 2020-03-12T23:32:09Z | |
| date issued | 2014 | |
| identifier other | 6897333.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1115153?show=full | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Material characterization of a novel lead-free solder material — SACQ | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8284558 | |
| subject keywords | Big data | |
| subject keywords | Context | |
| subject keywords | Data compression | |
| subject keywords | Decoding | |
| subject keywords | Encoding | |
| subject keywords | Redundancy | |
| subject keywords | Throughput | |
| subject keywords | big data | |
| subject keywords | distributed computing | |
| subject keywords | minimum description length | |
| subject keywords | parallel algorithms | |
| subject keywords | redundancy | |
| subject keywords | two-pass code | |
| subject keywords | universal data compression | |
| identifier doi | 10.1109/GlobalSIP.2014.7032133 | |
| journal title | lectronic Components and Technology Conference (ECTC), 2014 IEEE 64th | |
| filesize | 2664101 | |
| citations | 0 | |
| contributor rawauthor | Tak-Sang Yeung , Sze, H. , Tan, K. , Sandhu, J. , Chong-Wei Neo , Law, E. | |
