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contributor authorFalat, Tomasz
contributor authorStojek, Krzysztof
contributor authorMatkowski, Przemyslaw
contributor authorPlatek, Bartosz
contributor authorFelba, Jan
contributor authorMoscicki, Andrzej
date accessioned2020-03-12T22:53:30Z
date available2020-03-12T22:53:30Z
date issued2014
identifier other7028379.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1098160?show=full
formatgeneral
languageEnglish
publisherIEEE
titleInfluence of sintering process parameters on mechanical strength of joints based on silver nano particles
typeConference Paper
contenttypeMetadata Only
identifier padid8239244
subject keywordsIEEE 802.15 Standards
subject keywordsn Wireless sensor networks
subject keywordsn Base station
subject keywordsn data aggregation
subject keywordsn energy efficient
subject keywordsn minimum spanning tree
subject keywordsn sensor nodes
identifier doi10.1109/ICRAIE.2014.6909311
journal titlelectronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
filesize370120
citations0


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