Structure reliability and characterization for FC package w/Embedded Trace coreless Substrate
| contributor author | Chen, Eason | |
| contributor author | Lan, Albert | |
| contributor author | You, Jack | |
| contributor author | Liao, Mark | |
| date accessioned | 2020-03-12T22:53:24Z | |
| date available | 2020-03-12T22:53:24Z | |
| date issued | 2014 | |
| identifier other | 7028314.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1098098?show=full | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Structure reliability and characterization for FC package w/Embedded Trace coreless Substrate | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8239149 | |
| subject keywords | Routing | |
| subject keywords | n Location | |
| subject keywords | n Shortest Path | |
| subject keywords | n backtracking | |
| subject keywords | n label setting | |
| subject keywords | n label-correction | |
| identifier doi | 10.1109/ICRAIE.2014.6909250 | |
| journal title | lectronics Packaging Technology Conference (EPTC), 2014 IEEE 16th | |
| filesize | 200268 | |
| citations | 0 |
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