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Failure analysis and elimination method of pitting problem on microchip Al bond pads in wafer fabrication

contributor authorJingwei Peng
contributor authorPo Li
contributor authorGuoguang Rong
contributor authorXinrui Xu
date accessioned2020-03-12T22:44:18Z
date available2020-03-12T22:44:18Z
date issued2014
identifier other7021511.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1092858?show=full
formatgeneral
languageEnglish
publisherIEEE
titleFailure analysis and elimination method of pitting problem on microchip Al bond pads in wafer fabrication
typeConference Paper
contenttypeMetadata Only
identifier padid8232112
subject keywordsaerospace components
subject keywordsn aircraft antennas
subject keywordsn meteorological radar
subject keywordsn numerical analysis
subject keywordsn radar antennas
subject keywordsn radomes
subject keywordsn aircraft antenna
subject keywordsn antenna behavior
subject keywordsn automatic landing system antennas
subject keywordsn complex dielectric structure
subject keywordsn electromagnetic impact simulation prediction
subject keywordsn fuselage
subject keywordsn metallic strips
subject keywordsn nose radome
subject keywordsn numerical methodology
subject keywordsn side lobes
subject keywordsn weather radar antenna
subject keywordsn Antenna measurements
subject keywordsn Antenna radiation patterns
subject keywordsn Dielectrics
subject keywordsn Dipo
identifier doi10.1109/EuCAP.2014.6902510
journal titleolid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on
filesize2083728
citations0


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